? semiconductor components industries, llc, 2011 november, 2011 ? rev. p1 1 publication order number: cm1773 ? 5006yl/d CM1773-5006YL product preview 1-channel esd protector product description the cm1773 ? 5006yl provides robust esd protection for sensitive parts that may be subjected to electrostatic discharge (esd). the tiny form factor means it can be used in very confined spaces. the electrical back ? to ? back diodes configuration provides esd protection in cases where nodes with ac signals are present. this device is designed and characterized to safely dissipate esd strikes of at least 5 kv, according to the mil ? std ? 883 (method 3015) specification for human body model (hbm) esd. features ? compact die protects from esd discharges ? almost no conduction at signal amplitudes less than 180 v ? esd protection over 5 kv contact discharge per mil ? std ? 883 international esd standard applications ? led lighting ? modules ? interface circuits au (gold) bump on topside (signal node) silicon substrate on backside figure 1. electrical schematic au (gold) bump on topside (reference node) ordering information ordering part number topside metal back metal bg thickness inking? shipping method cm1773 ? 5006yl gold (au) none (silicon substrate) 6 mils no metal ring this document contains information on a product under development. on semiconductor reserves the right to change or discontinue this product without notice. http://onsemi.com
cm1773 ? 5006yl http://onsemi.com 2 maximum ratings / operating conditions parameter rating unit operating temperature range ? 40 to +150 c storage temperature range ? 55 to +150 c stresses exceeding maximum ratings may damage the device. maximum ratings are stress ratings only. functional operation above t he recommended operating conditions is not implied. extended exposure to stresses above the recommended operating conditions may af fect device reliability. electrical operating characteristics symbol parameter test conditions min typ max unit i leak leakage current v = +180 v, t a = 25 c v = ? 180 v, t a = 25 c +1.0 ? 1.0 a v bd breakdown voltage on signal node t a = 25 c; at 100 a at ? 100 a +200 ? 280 +240 ? 240 +280 ? 200 v v v esd esd protection ? withstand voltage human body model mil ? std ? 883 (method 3015) (note 1) 5.0 kv 1. per the standard, 3 positive and 3 negative strikes are applied, one second apart. mechanical details mechanical specifications (note 2) parameter condition unit composition silicon wafer, n+ doped die shape rectangular die length 480 10 m die width 440 10 m thickness 6.0 0.5 mils top pad length (a) 328 5.0 m top pad width (b) 100 5.0 m top pad spacing (d) 105 5.0 m top pad composition au (gold) top pad thickness 3 1.5 m back metal (backside) none (silicon substrate) 2. dimensions are typical values if tolerances are not specified. figure 2. sawn die diagram
cm1773 ? 5006yl http://onsemi.com 3 on semiconductor and are registered trademarks of semiconductor components industries, llc (scillc). scillc reserves the right to mak e changes without further notice to any products herein. scillc makes no warranty, representation or guarantee regarding the suitability of its products for an y particular purpose, nor does scillc assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including wi thout limitation special, consequential or incidental damages. ?typical? parameters which may be provided in scillc data sheets and/or specifications can and do vary in different application s and actual performance may vary over time. all operating parameters, including ?typicals? must be validated for each customer application by customer?s technical experts. scillc does not convey any license under its patent rights nor the rights of others. scillc products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the scillc product could create a sit uation where personal injury or death may occur. should buyer purchase or use scillc products for any such unintended or unauthorized application, buyer shall indemnify and hold scillc and its of ficers, employees, subsidiaries, af filiates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, direct ly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that scillc was negligent regarding the design or manufacture of the part. scillc is an equal opportunity/affirmative action employer. this literature is subject to all applicable copyright laws and is not for resale in any manner. publication ordering information n. american technical support : 800 ? 282 ? 9855 toll free usa/canada europe, middle east and africa technical support: phone: 421 33 790 2910 japan customer focus center phone: 81 ? 3 ? 5817 ? 1050 cm1773 ? 5006yl/d literature fulfillment : literature distribution center for on semiconductor p.o. box 5163, denver, colorado 80217 usa phone : 303 ? 675 ? 2175 or 800 ? 344 ? 3860 toll free usa/canada fax : 303 ? 675 ? 2176 or 800 ? 344 ? 3867 toll free usa/canada email : orderlit@onsemi.com on semiconductor website : www.onsemi.com order literature : http://www.onsemi.com/orderlit for additional information, please contact your local sales representative
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